this is information on a product in full production . june 2014 docid024128 rev 2 1/9 ESDAXLC6-1BU2K single-line bidirectional esd protection for high s peed interface datasheet - production data figure 1. functional diagram (top view) features bidirectional device extra low diode capacitance: 0.25 pf low leakage current 0201 smd package size compatible ultra small pcb area: 0.18 mm 2 ecopack ? 2 and rohs compliant component complies with the following standards: iec 61000-4-2 level 4 C 15 kv (air discharge) C 8 kv (contact discharge) applications where transient overvoltage protection in esd sensitive equipment is required, such as: smartphones, mobile phone and accessories tablet pcs, netbooks and notebooks portable multimedia devices and accessories digital cameras and camcorders communication and highly integrated systems description the ESDAXLC6-1BU2K is a bidirectional single line tvs diode designed to protect the data lines or other i/o ports against esd transients. the device is ideal for applications where both reduced line capacitance and board space saving are required. 0201 package pin 1 available in different forms pin1 www.st.com
characteristics ESDAXLC6-1BU2K 2/9 docid024128 rev 2 1 characteristics note: for a surge greater than the maximum values, t he diode will fail in short-circuit figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage: iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 8 20 kv p pp peak pulse power (8/20 s) 30 w i pp peak pulse current (8/20 s) 1 a t j operating junction temperature range - 40 to +150 c t stg storage temperature range - 65 to +150 c t l maximum lead temperature for soldering during 10 s 2 60 c symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = peak pulse current c = parasite capacitance r br rm rm rm pp d = dynamic impedance t = voltage temperature coefficient table 2. electrical characteristics (values, t amb = 25 c) symbol test condition min. typ. max. unit v br i r = 1 ma 6 v i rm v rm = 3 v 1 70 na v cl i pp = 1 a, 8/20 a 19 v c line f = (200 mhz- 3000 mhz), v r = 0 v 0.24 0.35 pf r d dynamic resistance, pulse duration 100 ns i/o to gnd - 2.35 - ? gnd to i/o - 2.38 -
docid024128 rev 2 3/9 ESDAXLC6-1BU2K characteristics 9 figure 3. leakage current versus junction temperature (typical values) figure 4. junction capacitance versus applied voltage (typical values) i r (na) 0.01 0.1 1 10 25 50 75 100 125 t j (c) 150 0 100 200 300 400 500 0.00 1.00 2.00 3.00 4.00 5.00 6.00 c (ff) v r (v) tj = 25 cf = 1 mhz v osc = 30 mv rms figure 5. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 6. esd response to iec 61000-4-2 (-8 kv contact discharge) 50 v/div 20 ns/div 168 v 36 v 34 v 1 2 3 14 v 4 v : esd peak voltage v :clamping voltage at 30 ns v :clamping voltage at 60 ns ppcl cl v :clamping voltage at 100 ns cl 1 2 3 4 50 v/div -37 v -27 v -13 v 2 4 3 -167 v 1 v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns ppcl cl v :clamping voltage @ 100 ns cl 1 2 3 4 20 ns/div figure 7. tlp measurements figure 8. s21 attenuation measurement results 0 5 10 15 20 25 0 5 10 15 20 25 30 35 40 45 50 55 60 i/o to gnd gnd to i/o i pp (a) v cl (v) 10m 100m 1g 10g 100g -4 -3.5 -3 -2.5 -2 -1.5 -1 -0.5 0 db f/hz esdaxlc6 - 1bu2k f (hz) db
package information ESDAXLC6-1BU2K 4/9 docid024128 rev 2 2 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st off ers these devices in different grades of ecopack ? packages, depending on their level of environmenta l compliance. ecopack ? specifications, grade definitions and product statu s are available at: www.st.com . ecopack ? is an st trademark. figure 9. st0201 dimension definitions table 3. 0201 package dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.23 0.28 0.33 0.0091 0.0110 0.0130 b1 0.20 0.25 0.30 0.0079 0.0098 0.0118 b2 0.20 0.25 0.30 0.0079 0.0098 0.0118 d 0.25 0.30 0.35 0.0099 0.0118 0.0138 e 0.55 0.60 0.65 0.0217 0.0236 0.0256 e 0.35 0.0138 l1 0.13 0.18 0.23 0.0052 0.0071 0.0091 l2 0.14 0.19 0.24 0.0055 0.0075 0.0095 e d a l1 l1 l2 l2 e e b2 b2 b1 b1 top side bottom pin 1 available in different forms pin 1 bottom
docid024128 rev 2 5/9 ESDAXLC6-1BU2K package information 9 note: product marking may be rotated by 180 for ass embly plant differentiation. in no case should this product marking be used to orient the c omponent for its placement on a pcb. only pin 1 mark is to be used for this purpose. figure 12. tape and reel specifications figure 10. footprint, dimensions in mm (inches) figure 11. marking 0.243 (0.0096) 0.170 (0.0067) 0.300 (0.0118) 0.243 (0.0096) 0.656 (0.0258) pin2 pin 1 z1 bar indicates pin 1 user direction of unreeling all dimensions in mm 4.0 2.0 8.0 2.0 1.75 3.5 ? 1.55 0.34 0.38 0.22 0.67 z1 z1 z1 z1 z1 z1 z1
recommendations on pcb assembly ESDAXLC6-1BU2K 6/9 docid024128 rev 2 3 recommendations on pcb assembly 3.1 stencil opening design figure 13. recommended stencil windows position 3.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. no clean solder paste is recommended. 3. offers a high tack force to resist component mov ement during high speed 4. solder paste with fine particles: powder particl e size is 20-45 m. 0.230 (0.0091) 0.183 (0.0072) 0.170 (0.0067) 0.300 (0.0118) 0.285 (0.0112) 0.656 (0.0258) 0.643 (0.0253) footprint stencil window 0.007 (0.00027) 0.007 (0.00027) 0.008 (0.0003) 0.008 (0.0003) mm (inches) 0.243 (0.0096)
docid024128 rev 2 7/9 ESDAXLC6-1BU2K recommendations on pcb assembly 9 3.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition ca pabilities of the placement system, not the outline centering 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much p lacement force can lead to squeezed out solder paste and cause solder joints t o short. too low placement force can lead to insufficient contact between package an d solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bot tom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (a ll the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 3.4 pcb design preference 1. to control the solder paste amount, the closed vi a is recommended instead of open vias. 2. the position of tracks and open vias in the sold er area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 3.5 reflow profile figure 14. st ecopack ? recommended soldering reflow profile for pcb mount ing note: minimize air convection currents in the reflow oven to avoid component movement. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6 c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
ordering information ESDAXLC6-1BU2K 8/9 docid024128 rev 2 4 ordering information figure 15. ordering information scheme 5 revision history table 4. ordering information order code marking weight base qty delivery mode ESDAXLC6-1BU2K z1 (1) 1. the marking can be rotated by 180 to differentia te assembly location 0.124 mg 15000 tape and reel esda xlc 6 - 1b u2 k esda array extra low capacitance package u2 = st0201 custom code breakdown voltage direction 6 = 6 v min b = bidirectional table 5. document revision history date revision changes 09-jan-2012 1 initial release. 05-jun-2014 2 added figure 7 . updated package graphics.
docid024128 rev 2 9/9 ESDAXLC6-1BU2K 9 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (st) reserve the right to make changes, corrections, modifications o r improvements, to this document, and the products and services described herein at any time, without notice. all st products are sold pursuant to sts terms and conditions of sale. purchasers are solely responsible for the choice, s election and use of the st products and services de scribed herein, and st assumes no liability whatsoever relating to the choice, select ion or use of the st products and services describe d herein. no license, express or implied, by estoppel or othe rwise, to any intellectual property rights is grant ed under this document. if any part of this document refers to any third party products or serv ices it shall not be deemed a license grant by st f or the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the u se in any manner whatsoever of such third party products or services or any intellectua l property contained therein. unless otherwise set forth in sts terms and condit ions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a partic ular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent , copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems wit h product functional safety requirements; (b) aeronautic applications; (c) automotive application s or environments, and/or (d) aerospace application s or environments. where st products are not designed for such use, the purchaser shall use products at purchasers sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for a utomotive, automotive safety or medical industry domains according to st product design specificatio ns. products formally escc, qml or jan qualified ar e deemed suitable for use in aerospace by the corresp onding governmental agency. resale of st products with provisions different fro m the statements and/or technical features set fort h in this document shall immediately void any warranty granted by st for the st product or se rvice described herein and shall not create or exte nd in any manner whatsoever, any liability of st. st and the st logo are trademarks or registered tra demarks of st in various countries. information in this document supersedes and replace s all information previously supplied. the st logo is a registered trademark of stmicroele ctronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - cze ch republic - finland - france - germany - hong kon g - india - israel - italy - japan - malaysia - malta - morocco - philippines - singapor e - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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